Profile Wrapping - Diamond


Equipment used to cover linear profiles with the most diverse geometries, with melamine paper, PET, PVC, external PVC, fabrics, or similar flexible products, through a hot bonding process (EVA/PO/PUR adhesive) and strategic pressure.

There is a gain in production quality at reduced cost, transforming machined profiles into fully finished ones, in a single process. The covering can be carried out on porous profiles of chipboard, MDF, MDP, pine, wood etc.

Contact Unesa to find out about the various possible configurations of this equipment.

Technical specifications

Equipment dimensions:
- Length: 6,000 mm.
- Width: 1,150 mm.
- Height: 2,000 mm.
Profile dimensions:
- Length: 600-inf. mm.
- Width: 01-300 mm.
- Height: 10-60 mm.

Payment methods

Formas de pagamento